Assembly Techniques
Our Printed Circuit Board Assembly capablities give our customers the convience of a "One Stop Solution" to their PCB Assembly needs. Our advanced capabilities include Surface Mount Technology(SMT), Thru-hole, Mixed Technology(SMT & Thru-hole), Single or Double Sided Placement, Fine Pitch Components, and much more.
- Wave Soldering
- Reflow Soldering
- Automated SMT Assembly
- Through hole & Mixed technology boards.
- Proto typing
- Re-engineering
- SMD and PTH technology
- BGA rework capability includes Re-Balling of BGA components
- Box build for any requirements (Consoles and Jigs)
- Material sourcing and purchasing
- RoHS compliant processing
